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Device: R5F104EHxNA [WQFN40]

Manufacturer: Renesas

Part number description for this device:

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R Renesas Semiconductor Product  
X Device Type 5 = MCU
X Memory Type F = Flash memory
XXX Group 100 = RL78/G13, Data flash is provided
101 = RL78/G13, Data flash is not provided
102 = RL78/G12, Data flash is provided
103 = RL78/G12, Data flash is not provided
104 = RL78/G14
105 = RL78/G11
107 = RL78/I1A
109 = RL78/F12
110 = RL78/L1C, products with USB
111 = RL78/L1C, products without USB
113 = RL78/F15
10A = RL78/F13
10B = RL78/F13
10C = RL78/D1A
10D = RL78/D1A
10E = RL78/G1A
10J = RL78/G1C, USB host/function controller mounted
10K = RL78/G1C, USB function controller mounted
10P = RL78/F14
10R = RL78/L12
10W = RL78/L13
10Y = RL78/G10
117 = RL78/I1D
11A = RL78/G1D
11B = RL78/G1F
11C = RL78/I1E
11E = RL78/G1D
11F = RL78/G1H
11M = RL78/L1A
11N = RL78/I1C, On-chip AES circuit
11T = RL78/I1C, No on-chip AES circuit
121 = RL78/G16
X Pin Count 1 = 10-pin
4 = 16-pin
6 = 20-pin
7 = 24-pin
8 = 25-pin or 20 to 30-pin for RL78/G1A
A = 30-pin
B = 32-pin
C = 36-pin
D = 38-pin
E = 40-pin
F = 44-pin
G = 48-pin
J = 52-pin
L = 64-pin
M = 80-pin
N = 85-pin
P = 100-pin
S = 128-pin
X ROM Capacity 6 = 2KB
7 = 4KB
8 = 8KB
9 = 12KB
A = 16KB
C = 32KB
D = 48KB
E = 64KB
F = 96KB
G = 128KB
H = 192KB
J = 256KB
K = 384KB
L = 512KB
X Bonding Wire Material Blank = Au wire bonding products
C = Cu wire bonding products
X Classification A = Consumer applications, operating ambient temperature -40°C to 85°C
D, J = Industrial applications, operating ambient temperature -40°C to 85°C
G, L = Industrial applications, operating ambient temperature -40°C to 105°C
K, M = Industrial applications, operating ambient temperature -40°C to 125°C
Y = Industrial applications, operating ambient temperature -40°C to +150°C
XXX ROM Number - Omitted with blank product
XX Package Type BG = FBGA, 0,40mm pitch or TFBGA, 0.50mm pitch
FA = LQFP, 0,65mm pitch
FB = LQFP, LFQFP, 0,50mm pitch
FP = LQFP, 0,80mm pitch
LA = LGA, VFLGA, WFLGA, 0,50mm or 0.65mm pitch
NA = WQFN, HVQFN, 0.50mm pitch
NB = WQFN, HWQFN, 0,40mm pitch
SP = SSOP, 0,65mm pitch
#XX Packaging Specification #30 = Tray (LFQFP)
#30 = Tray (LFQFP, LQFP, LSSOP, SSOP), Tube (LSSOP)
#50 = Embosed Tape (LFQFP, LQFP, LSSOP, SSOP)
#U0 = Tray (VFLGA)
#V0 = Tray (SSOP)
#W0 = Embossed Tape (VFLGA)
#X0 = Embossed Tape (SSOP)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/WQFN40 ZIF R5F-1 (70-2600)
BeeHive208S adapter/module: DIL48/WQFN40 ZIF R5F-1 (70-2600)
BeeHive304 adapter/module: AP3 QFN40-1.02 R5F-1 (73-3765)
BeeProg2 adapter/module: DIL48/WQFN40 ZIF R5F-1 (70-2600)
BeeProg2C adapter/module: DIL48/WQFN40 ZIF R5F-1 (70-2600)
BeeProg3 adapter/module: AP3 QFN40-1.02 R5F-1 (73-3765)
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